Vendors Work Together to Advance 3G
Vendors Work Together to Advance 3G
According to a recent study, chipsets will need to receive both 3G and High Speed Downlink Packet Access (HSDPA) signals and be specialized for specific applications if new wireless applications are to take off. Broadcom recently rolled out a new multimedia mobile phone platform that will allow vendors to manufacture 3G handsets at low costs, which should promote new apps. Symbian and Freescale have introduced a reference design for a 3G smartphone based on Freescale's single 3G phone chip. This technology will allow handset manufacturers to focus on design, features and user interface. Atheros is collaborating with QUALCOMM to establish interoperability between Atheros' Radio-on-Chip for Mobile (ROCm) platform and some QUALCOMM chipsets. The goal: to make it easier to create devices that can flip between cellular and 802.11 g and a/g wireless local-area networks.
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http://ct.itbusinessedge.com/t?ctl=DA88F6:3C3C204
posted by Victor Lloyd Smith @ 4:05 PM
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